Wafer rotary table
Wafer spindle
Hydraulics –
Power units
Hydrostatic rotary table for wafer grinding
Advantages and features of a hydrostatic rotary table for wafer grinding
- Designed for wafer grinding with low or no viscosity
- Excellent concentricity / axial run-out – extremely good concentricity and flatness on the workpiece
- Excellent damping, no vibrations, thus increasing the surface quality on the workpiece
- Wear-free for an unlimited service life
- No friction at standstill, no stick-slip effect
- Absolute angle measuring system for positioning accuracy
Hydrostatic spindle for wafer grinding
Advantages and special features of
hydrostatic spindles for wafer processing
- Significantly higher rigidity and damping than spindles with air bearings
- Higher cutting force and higher cutting performance than with air-bearing spindles
- Significantly faster processing, especially for SiC wafers
Hydraulic unit for wafer grinding
Hydraulic unit for water
(currently in test phase)
- Content follows
